Secondary Pad Cold Plate

The secondary pad cold plate is approximately 145x150x3 cm in dimension, and serves both structural and cooling functions. Structurally, it shall support and provide mounting for roughly 650lbs of electronic equipment above, and 850lbs of components and material below. The plate will be mounted to a semi-truck and shall resist large vibrational loads. Thermally, the pad shall remove approximately 2,300W of heat with an embedded liquid cooling system. The maximum temperature across most of the pad’s surface shall remain at 80°C or below, with specific temperature limits varying across the pad. The pad shall utilize a 50-50 mix of ethylene glycol and water coolant flowing at 10gpm and 10psi, with an inlet temperature of 65°C.
Item will be built and shipped to Utah State University by June 30, 2023 for testing.

The vendor that has been identified for the fabrication of the secondary pad cold plate is Riverside Machine.
For questions, please reach out to robert.kekauoha@usu.edu .