Active

Contract Opportunity

1. Class Code: 6640

2. NAICS Code: 334513

3. Subject: One (1) ultra high vacuum nitride sputter deposition system

4. Solicitation Number: W911QX24Q0074

5. Set-Aside Code: Total Small Business Set-Aside ( Note: Offerors are required to identify if they are small business manufacturer or a small business reseller. If the Offerors are a small business reseller, the solicitation requires small business resellers to confirm that the product they are offering is manufactured by a small business in accordance with the Non-Manufacturer Rule).

6. Response Date: 19 April 2024

7. Place of Delivery/Performance:

U.S. Army Research Laboratory

Shipping & Receiving

Aberdeen Proving Ground

Aberdeen, MD 21005

8.

(i) This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation; proposals are being requested and a written solicitation will not be issued.

(ii) The solicitation number is W911QX24Q0074. This acquisition is issued as an request for quotation (RFQ)

(iii) The solicitation document and incorporated provisions and clauses are those in effect through Federal Acquisition Circular 2024-03.

(iv) The associated NAICS code is 334513. The small business size standard is 750 Employees.

(v) The following is a list of contract line item number(s) and items, quantities and units of measure, (including option(s), if applicable):

CLIN 0001: One (1) ultra high vacuum nitride sputter deposition system

CLIN 0002: Shipping

CLIN 0003: Installation

(vi) Description of requirements:

The Government requires One (1) ultra high vacuum nitride sputter deposition system

. The systems shall include the following:

Proven material development based on literature:

• To ensure a precedence for synthesizing ferroelectric nitride thin films, the Contractor shall provide reference to literature, which deposited the referenced material using the same/similar deposition chamber that the contractor is proposing. A strong track record is necessary to guarantee high quality ferroelectric properties; therefore, the following requirements must all be met in the provided reference(s):

o Aluminum nitride-based (AlMN) composition: AlxM1-xN (0.01
o Thickness: five (5) – 400 nanometers (nm)

o Coercive field: three (3) – six (6) MV cm-1 (megavolts per centimeter)

o Remnant polarization (PR): 80 – 130 μC cm-2 (microcoulomb per square centimeter)

General Characteristics of Deposition System:

• The system shall be a research and low volume (100 wafers per month) production-capable sputter deposition tool geared toward controlled growth of thin film nitride materials on up to 200 millimeters (mm) diameter transparent and opaque substrates.

• The system shall consist of a stainless-steel vacuum main chamber for material deposition with a base pressure less than (

• The interior of the main chamber shall be accessible through the top lid or side door for maintenance and target changes. The main chamber shall possess the ConFlat (CF) ports for at least the following components:

o Two (2) port for magnetically coupled viewports.

o One (1) port for load lock transfer

o One (1) port for residual gas analyzer (RGA)

o Two (2) ports for process gas introduction and venting

o Three (3) ports for vacuum gauges

o Two (2) spare ports for future reflection high energy electron diffraction (RHEED) integration

o Two (2) spare ports for future ellipsometer

• The load lock shall consist of a cassette tray for loading at least six (6) substrates at a time with automated sample transfer into and out of the main chamber.

• The system shall possess at least (four (4)) or (five (5)) four (4) inch (”) magnetron sputter sources within the main chamber.

• The main chamber, load lock, electronics rack, gas and liquid plumbing and controls shall be mounted on a frame. The frame shall come with leveling capability, heavy duty caster wheels, and removable safety panels. The roughing pump and water chiller may be installed apart from the main frame.

• Capability to transfer transparent and opaque substrates.

• Wafers can be loaded with consistent rotational alignment on main chamber substrate holder.

• The system shall be equipped with up to three (3) pulsed direct current (DC) power supplies and two (2) radio frequency (RF) power supplies to sustain sputter depositions of electrically insulating and conducting target materials between one (1) and 50 Millitorr (mTorr).

o A power supply switch between each of the sources and power supply types shall be included in order to use power supplies interchangeably with sputtering sources.

• The system shall have a software interface for recipe building, automated execution, and parameter tracking for a batch of material growths on each of the substrates contained within the load lock.

• The system shall be interlocked to provide safety checks and interruption to the process to prevent system damage based on water flow, chamber pressure, plasma detection, pneumatic controls (if installed), and power disruption.

• The sample holder shall provide substrate heating between 23 and 800 degrees Celsius (°C), substrate DC and RF biasing, rotation, and height control (throw distance).

Load lock configuration:

• Automated multi-substrate greater than (>) five (5) load lock for 100-, 150-, and 200-millimeter (mm) diameter wafers and a maximum height of at least 10 mm.

• Capability of automated wafer transfer between load lock and main chamber.

• Capability of roughing pump with pumping speed > five (5) cubic feet per minute (cfm), turbo pump > 500 liters per second (l/s), and isolation valve on turbo pump.

• Capability of isolation gate valve between load lock and main chamber.

• Capability of inert gas venting.

• Capability of O-ring sealed door for loading and unloading substrates.

• Capability of automated, motorized drive for slot selection and transfer,

• Substrate heating desired to degas prior to main chamber transfer.

• Capable of handling opaque and transparent substrates with Semiconductor Equipment and Materials International (SEMI) and Japan Electronics and Information Technology Industries Association (JEITA) specifications.

Main Chamber: sample fixture and manipulation:

• 100-, 150-, and 200-mm diameter substrates shall be readily compatible with appropriate wafer holders.

• Capable of handling opaque and transparent substrates with SEMI and JEITA specifications.

• Samples are consistently aligned with respect to rotation.

• The substrate can be heated between 23 and at least 800 °C with 10 degrees Celsius per minute (°C/min). Additionally, the wafer-to-wafer temperature variability must be
• Capability for electrically isolating substrate for DC and RF biasing with a maximum power output reaching greater than or equal to (≥) 50 watts (W).

• The substrate rotation speed can be variably controlled between zero (0) and 20 revolutions per minute (rpm), preferably in the software.

• The z-height of the substrate can be controlled between 100 - 200 mm distance from the sources, preferred minimum of 50 mm.

• A substrate shutter that can open/close (pneumatic control).

• At least two (2) interchangeable shutter and shielding sets must be supplied for cleaning.

• Each element on the process chamber must have a defined electrical contact state (floating, grounded or biased).

• The thickness uniformity across a 200 mm wafer must be within

• Shall have inert and reactive gas injection near the substrate surface for advanced deposition mode control.

Source configuration, performance, and control:

• Capability of four (4) or five (5) four (4) inch (”) magnetron sources with confocal alignment.

• At least two (2) shutter and shielding sets must be supplied easily interchangeable for cleaning and each element must have a defined electrical contact state (floating, grounded or biased).

• Each source shall have a pneumatically controlled shutter to allow pre-sputtering and prevent cross contamination of target surfaces.

• Each source shall have inert and reactive gas injection at the target surface for advanced target sputter mode control.

• Each source shall have back water cooling of the target.

• Source distance to substrate and tilt relative to substrate plane shall be adjustable.

• Sources shall be capable of RF, DC, and pulsed DC sputter operation while operating between two (2) – 20 mTorr process pressure.

• A switch relay shall be included to enable co-deposition and software-controlled source/power supply reconfiguration.

• All sources shall be able to operate simultaneous and independently.

Sputter source power supplies:

• Two (2) RF power supplies with matching networks of at least 600 W.

• Three (3) pulsed DC (pDC) power supplies of at least one (1) killowatt (kW), zero (0) -1000-volt (V) DC output, zero (0) to three (3) ampere (A) current output, and 10 – 200 kilohertz (kHz) output frequency. There shall be options of whether the dedicated pDC supply operates in either pulse mode or DC mode.

• One (1) designated RF bias supply for substrate biasing pre- and during deposition of at least 50 W.

• Capability to configure a pDC supply as a substrate bias.

• One (1) DC bias supply for substrate preferred.

• The system shall have an electronics rack with included power supplies installed.

Pressure performance, control, and monitoring:

• Two (2) > 10 cfm dry scroll roughing pump for main chamber and load lock.

• > 600 l/s cryo or turbomolecular pump (main chamber).

• >200 l/s turbo pump (load lock).

• Variable position gate valve and control for both downstream and upstream pressure control.

• Roughing valve and fore line.

• Convection gauge for 1 x 103 > 1 x 10-3 Torr pressure monitoring.

• Ion gauge for

• Capacitance manometer or similar high accuracy press gauge to monitor deposition.

• Residual gas analyzer (RGA) installed on the main chamber is preferred to monitor partial pressures of contaminating and working gases prior to and during depositions.

Gas distribution, management, and monitoring:

• At least four (4) mass flow controllers (MFCs) for flowing 20 standard cubic centimeter per minute (sccm) nitrogen (N2), 100 sccm argon (Ar), 20 sccm oxygen (O2), and 100 sccm additional gases (calibrated for N2) to enable upstream pressure control (as well as downstream).

• Capability to control Ar/N2 gas flow to each magnetron source with shut-off valves to direct gases for co-deposition processes.

• Vacuum coupling radiation (VCR) fittings and stainless tubing for gas distribution and provide vacuum tight seals to degas oxygen/moisture in lines.

• Compressed air for controlling pneumatic devices with compression fittings.

• Capability to switch gas flow inlet between magnetron sources and substrate.

• Oxygen and moisture scrubbing capability on N2 and Ar lines with indicator.

Water distribution and monitoring:

• The system shall have a closed-loop water chiller to maintain water temperatures below 35 °C during constant operation under harshest conditions (≥800 °C substrate temperature, 1000 W pulsed DC power on two sputter sources).

• The water shall provide cooling to the sputter sources, and other necessary components to prevent damage and provide higher safety.

Power distribution and management:

• Single drop 208 V alternating current (AC), 60 hertz (Hz), three (3) phase, five (5) wire.

• Wired to a central hub for distribution.

• The system shall have an emergency off (EMO) switch.

Software control and interface:

• The system shall be fully controllable from an included dedicated computer station.

• The computer interface shall provide real-time information of all the deposition system hardware signals and statuses, and the computer shall log the system data throughout each recipe.

• The computer shall allow for multiple user accounts.

In-situ monitoring tools:

• The system shall have a quartz crystal monitor (QCM) to accurately measure sputter deposition rate at the same throw distance as the sample surface. This capability shall come with necessary components such as feedthroughs, cables, analyzer, and communicate with provided computer.

• The system is preferred to have a residual gas analyzer (RGA) to monitor partial pressures of gases ranging between one (1) to 100 amu between the system base pressure and at least 10 mTorr.

Spare parts / add-ons:

• One (1) additional set of liners, shields, mounts, substrate adapters.

• Optional: water chiller, roughing pump, cryo/turbo pump, heating jacket.

• Uninterruptable power supply backup at a capacity of supporting the vacuum pumps in the case of a one (1) hour shutdown.

The Contractor shall ensure the system meets the following requirements:

• The system shall meet current industry standard requirements for safety as regulated by the Occupational Safety and Health Administration (OSHA) and National Electrical Code (NEC) including the use of EMO (Emergency Off) panic buttons, shielding and interlocks for hazardous areas including high voltages, radiation, heat, and moving parts.

• The system shall have signage denoting the hazards present.

• The Contactor shall provide one (1) spare parts kit consisting of items subject to relatively rapid wear such as would be provided to 24 hours per day, 7 days per week (24/7) customers.

• The system shall come with two (2) complete sets of schematics including electrical diagrams, two (2) complete operating manuals written in English, and one (1) manual on clean room paper.

• The Contractor shall provide factory testing prior to delivery to Adelphi Laboratory Center (ALC) based on Government provided material qualifications for aluminum nitride (AlN) and molybdenum (Mo) depositions including uniformity, thickness, deposition rate, and purity. Additional specifications will require validation:

o Particle count test

o O2 and H2O background reproducibility

o Deposition stability over 100 wafers with 2% thickness variation and 5% wafer variation.

• 2-3 days factory acceptance testing at contractor’s factory.

• The system shall have shipping costs that include insurance and customs fees.

• The Contractor shall ensure that the electrical components within the deposition system are based on voltages, frequency and currents commonly used in the United States of America that include 120, 208, 240, and 480 Volts.

• The Contractor shall deliver and install the sputter deposition system to the Army Research Laboratory (ARL), 2800 Powder Mill Road, Specialty Electronic Materials and Sensors Cleanroom (SEMASC) facility.

• The Contractor shall prove to the Government that the deposition system is fully functional after the system has been installed using Government created acceptance tests.

• The Contractor shall submit a post-installation acceptance test report to the Government outlining the results of the acceptance tests. The Government will approve the acceptance test report within one (1) week of receiving the results.

• The Contractor shall conduct operator and maintenance training following the installation of the sputter deposition system at the Government’s site. For the training purposes, the Contractor shall travel to the ARL in Adelphi, Maryland, to provide operator and maintenance training for up to eight (8) participants.

• The Contractor shall provide access to a technical support person to answer questions regarding tool operation, hardware troubleshooting and basic processes via telephone or email during normal business hours for the time zone of the contractor’s main base of operation for the duration of ownership by the Government.

The day the Government approves the post-installation report, the Contractor shall provide a warranty on the sputter deposition system for at least one (1) year that meets the following minimum requirements:

• The warranty shall cover repairs or modifications if the deposition system is no longer functional.

• The warranty shall cover labor and transportation costs including airfare, accommodation and per diems to and from ARL for the technical support individual when necessary.

• The warranty shall guarantee a response time of forty-eight (48) hours from the time the Government calls or emails for a request for service.

• The warranty shall cover all parts excluding consumable parts and materials including sputter targets, vacuum gauge tubes, pump oils and greases, filter elements, ion source filaments, grids and liners.

(vii) Delivery is required 12-months after contract award (ACA). Delivery shall be made to ADELPHI LABORATORY CENTER, 2800 Powder Mill Road, Adelphi, MD 20783-1138, truck shipments are accepted at Building #102, Receiving Room, Monday through Friday (except holidays) from 7:30 AM to 4:00 PM only. The FOB point is Destination.

(viii) The provision at 52.212-1, Instructions to Offerors – Commercial, applies to this acquisition. The following addenda have been attached to this provision: N/A

(ix) The provision at FAR 52.212-2, Evaluation - Commercial Items is applicable to this acquisition. The specific evaluation criteria to be included in paragraph (a) of that provision are as follows:

In accordance with FAR 13.106-2(b)(3), comparative evaluation procedures will be utilized. Comparative evaluation is the comparison of all offers received in response to this solicitation against each other. An item-by-item comparison of each offer to one another will be performed to determine which offer provides the most benefit to the Government. Award will be made to the offer that is most advantageous to the Government. The Government may award to the lowest priced offeror that meets the Government’s minimum requirements; however, the Government reserves the right to award to a higher priced offeror exceeding the minimum requirements if it is most advantageous to the Government. In order to be considered for award, an offer must meet the Government’s minimum technical requirement contained in this solicitation. The below evaluation factors will be utilized during evaluation (in no order of relative importance):

Price

Technical Capabilities/Specification

Past Performance

(x) Offerors shall include a completed copy of the provision at FAR 52.212-3 (with its Alternate I), Offeror Representations with its offer. N/A

(xi) The clause at 52.212-4, Contract Terms and Conditions - Commercial Items, applies to this acquisition. The following addenda have been attached to this clause N/A

(xii) The clause at 52.212-5, Contract Terms and Conditions Required to Implement Statutes or Executive Orders - Commercial Items and the selected clauses listed in DFARS 212.301 Solicitation provisions and Contract Clauses for the Acquisition of Commercial Items, applies to this acquisition. The following additional FAR/DFARS clauses cited in this clause are applicable:

FAR:

52.203-6 Alt I: RESTRICTIONS ON SUBCONTRACTOR SALES TO THE GOVERNMENT (JUN 2020)

52.204-10: REPORTING EXECUTIVE COMPENSATION AND FIRST-TIER SUBCONTRACT AWARDS (OCT 2018)

52.204-25: PROHIBITON ON CONTRACTING FOR CERTAINTELECOMMUNICATIONS AND SURVEILLANCE SERVICES OR EQUIPMENT.

52.204-27: PROHIBITION ON A BYTDANCE COVERED APPLICATION

52.209-6: PROTECTING THE GOVERNMENT’ INTEREST WHEN SUBCONTRACTING WITH CONTRACTORS DEBARRED, SUSPENDED, OR PROPOSED FOR DEBARMENT (NOV 2021)

52.219-6: NOTICE OF TOTAL SMALL BUSINESS SET-ASIDE (MAR 2020)

52.219-8: UTILIZATION OF SMALL BUSINESS CONCERNS (DEVIATION 2023-O0002) (DEC 2022)

52.219-14: LIMITATIONS ON SUBCONTRACTING (OCT 2022)

52.219-28: POST-AWARD SMALL BUSINESS PROGRAM REREPRESENTATION (SEP 2021)

52.219-33: NONMANFACTURER RULE (SEP 2021)

52.222-3, CONVICT LABOR (JUN 2003)

52.222-19, CHILD LABOR--COOPERATION WITH AUTHORITIES AND REMEDIES (JAN 2022)

52.222-21: PROHIBITION OF SEGREGATED FACILITIES (APR 2015)

52.222-26: EQUAL OPPORTUNITY (SEP 2016)

52.222-35: EQUAL OPPORTUNITY FOR VETERANS (OCT 2015)

52.222-36: AFFIRMATIVE ACTION FOR WORKERS WITH DISABILITIES (JUL 2014)

52.222-37: EMPLOYMENT REPORTS ON SPECIAL DISABLED VETERANS, VETERANS OF THE VIETNAM ERA, AND OTHER ELIGIBLE VETERANS (FEB 2016)

52.222-40: NOTIFICATION OF EMPLOYEE RIGHTS UNDER THE NATIONAL LABOR RELATIONS ACT (DEC 2010)

52.222-50: COMBATING TRAFFICKING IN PERSONS (NOV 2021)

52.223-18: ENCOURAGING CONTRACTOR POLICIES TO BAN TEXT MESSAGING WHILE DRIVING (AUG 2011)

52.225-13: RESTRICTIONS ON CERTAIN FOREIGN PURCHASES (JUN 2008)

52.232-33: PAYMENT BY ELECTRONIC FUNDS TRANSFER—CENTRAL CONTRACTOR REGISTRATION (OCT 2018)

DFARS:

*252.203-7005: REPRESENTATION RELATING TO COMPENSATION OF FORMER DOD OFFICIALS (NOV 2011)

252.204-7004: DOD ANTITERRORISM AWARENESS FOR CONTRACTORS (FEB 2019)

252.204-7015: DISCLOSURE OF INFORMATION TO LITIGATION SUPPORT CONTRACTORS (MAY 2016)

*252.204-7016: COVERED DEFENSE TELECOMMUNICATIONS EQUIPMENT OR SERVICES—REPRESENTATION (DEC 2019)

*252.204-7017: PROHIBITION ON THE ACQUISITON OF COVERED DEFENSE TELECOMMUNICATIONS EQUIPMENT OR SERVICES—REPRESENTATION (DEC 2019)

252.204-7018: PROHIBITION ON THE ACQUISITION OF COVERED DEFENSE TELECOMMUNICATIONS EQUIPMENT OR SERVICES (JAN 2021)

252.204-7022: EXPEDITING CONTRACT CLOSEOUT (MAY 2021)

*252.213-7000: NOTICE TO PROSPECTIVE SUPPLIERS ON USE OF PAST PERFORMANCE INFORMATION RETRIEVAL SYSTEM—STATISTICAL REPORTING IN PAST PERFORMANCE EVALUATIONS (MAR 2018)

*252.215-7008: ONLY ONE OFFER (DEC 2022)

252.223-7008: PROHIBITION OF HEXAVALENT CHROMIUM (JUN 2013)

252.225-7001: BUY AMERICAN AND BALANCE OF PAYMENTS PROGRAM

252.225-7007: PROHIBITION ON ACQUISITION OF CERTAIN ITEMS FROM COMMUNIST CHINESE MILITARY COMPANIES (DEC 2018)

252.225-7012: PREFERENCE FOR CERTAIN DOMESTIC COMMODITIES (DEC 2017)

252.225-7048: EXPORT-CONTROLLED (JUNE 2013)

252.225-7052: RESTRICTION ON THE ACQUISITION OF CERTAIN MAGNETS AND TUNGSTEN (JAN 2023)

*252.225-7055: REPRESENTATION REGARDING BUSINESS OPERATIONS WITH THE MADURO REGIME (MAY 2022)

252.225-7056: PROHIBITION REGARDING BUSINESS OPERATIONS WITH THE MADURO REGIME (JAN 2023)

252.226-7001: UTILIZATION OF INDIAN ORGANIZATIONS, AND INDIAN-OWNED ECONOMIC ENTERPRISES, AND NATIVE HAWAIIAN SMALL BUSINESS CONCERNS (APR 2019)

252.232-7010: LEVIES ON CONTRACT PAYMENTS (DEC 2006)

252.243-7002: REQUESTS FOR EQUITABLE ADJUSTMENT (DEC 2012)

252.244-7000: SUBCONTRACTS FOR COMMERCIAL ITEMS (JUN 2013)

252.246-7008: SOURCES OF ELECTRONIC PARTS (MAY 2018)

252.247-7023: TRANSPORTATION OF SUPPLIES BY SEA (FEB 2019)

(xiii) The following additional contract requirement(s) or terms and conditions apply (full text of all FAR/DFARS clauses that contain fill-in information, as well as all local clauses, can be found in the attached Provisions and Clauses Full-Text document):

FAR PROVISIONS:

52.204-7: SYSTEM FOR AWARD MANAGEMENT (OCT 2018)

52.204-16: COMMERCIAL AND GOVERNMENT ENTITY CODE REPORTING (AUG 2020)

52.204-20: PREDECESSOR OF OFFEROR (AUG 2020)

52.204-24: REPRESENTATION REGARDING CERTAIN TELECOMMUNICATIONS AND VIDEO SURVEILLANCE SERVICES OR EQUIPMENT (NOV 2021)

52.204-26: COVERED TELECOMMUNICATIONS EQUIPMENT OR SERVICES-REPRESENTATION (OCT 2020)

52.209-7: INFORMATION REGARDING RESPONSIBIITY MATTERS (JUL 2013)

52.233-2: AFFIRMATIVE PRCUREMNT OF BIOBASED PRODUCTS UNDER SERVICE ND CONSTRUCTION CONTRACTS (SEP 2006)

52.252-1: SOLICITATION PROVISIONS INCORPORATED BY REFERENCE

FAR/DFARS CLAUSES:

52.201-1: DEFINITIONS (JUN 2020)

52.203-3: GRATUITIES (APR 1984)

52.204-13: SYSTEM FOR AWARD MANAGEMENT (OCT 2018)

52.204-18: COMMERCIAL AND GOVERNMENT ENTITY CODE MAINTENANCE (AUG 2020)

52.204-19: INCORPORATON BY REFERENCE OF REPRESENTATIONS AND CERTIFICATIONS (DEC 2014)

52.204-21: BASIC SAFEGUARDING OF COVERED CONTRACTOR INFORMATION SYSTEMS (NOV 2021)

52.232-39: UNEFORCEABILITY OF UNAUTHORIZED OBLIGATIONS (JUN 2013)

52.233-1: DISPUTES – ALTERNATE I (MAY 2014)

52.243-1: CHANGES—FIXED PRICE (AUG 1987)

52.247-34: F.O.B. DESTINATION (NOV 1991)

52.252-2: CLAUSES INCORPORATED BY REFERENCE (FEB 1998)

252.203-7000: REQUIREMENTS RELATING TO COMPENSATION OF FORMER DOD OFFICIALS (SEP 2011)

252.203-7002: REQUIREMENT TO INFORM EMPLOYEES OF WHISTLEBLOWER RIGHTS (SEP 2013)

252.204-7000: DISCLOSURE OF INFORMATION (OCT 2016)

252.204-7003: CONTROL OF GOVERNMENT PERSONNEL WORK PRODUCT (APR 1992)

252.204-7012: SAFEGUARDING COVERDED DEFENSE INFORMATION AND CYBER INCIDENT REPORTING (DEC 2019)

252.211-7003: ITEM UNIQUE IDENTIFICATION AND VALUATION (MAR 2022)

252.232-7003: ELECTRONIC SUBMISSION OF PAYMENT REQUESTS AND RECEIVING REPORTS (DEC 2018)

252.232-7006: WIDE AREA WORKFLOW PAYMENT INSTRUCTIONS (DEC 2018)

252.243-7001: PRICING OF CONTRACT MODIFICATIONS (DEC 1991)

ADELPI LOCAL INSTRUCTION PROVISIONS:

EXCEPTIONS IN PROPOSAL

AWARD OF CONTRACT

ADELPHI CONTR. DIVISION URL

FOREIGN NATIONALS PERFORMING

PAYMENT TERMS

ADELPHI LOCAL INSTRUCTION CLAUSES:

ACC - APG POINT OF CONTACT

TECHNICAL POINT OF CONTACT

TYPE OF CONTRACT

GOVERNMENT INSPECTION AND ACCEPTANCE

TAX EXEMPTION CERTIFICATE (ARL)

PAYMENT INSTRUCTIONS

RECEIVING ROOM – ARL

AT-OPSEC REQUIREMENT

DISTRIBUTION A

DFARS COMMERCIAL CLAUSES

(xiv) This acquisition is rated under the Defense Priorities and Allocations System (DPAS) as N/A.

(xv) The following notes apply to this announcement:

a. In accordance with FAR 32.003, the Government cannot provide contract financing for this acquisition.

(xvi) Offers are due 19 April 2024, by 11:59 (noon) Eastern Standard Time (EST), at crystal.l.demby.civ@army.mil

(xvii) For information regarding this solicitation, please

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